IEC 60352-5:2003 pdf free download

IEC 60352-5:2003 pdf free download Solderless connections – Part 5: Press-in connections – General requirements, test methods and practical guidance
1 scope and object
This part of lEC 60352 is applicable to solderless press-in connections for use in tele-communication equipment and in electronic devices employing similar techniques.
The press-in connection consists of a termination having a suitable press-in zone which isinserted into a plated-through hole of a double-sided or multilayer printed board.
Information on materials and data from industrial experience is included in addition to the testprocedures to provide electrically stable connections under prescribed environmentalconditions.
The object of this part of lEC 60352 is to determine the suitability of press-in connections underspecified mechanical, electrical and atmospheric conditions.
Only compliant press-in zones can be qualified according to this specification.Solid press-in zones are in use.Information about these is given in annex A.
2 Normative references
The following referenced documents are indispensable for the application of this document.Fordated references, only the edition cited applies.For undated references,the latest edition ofthe referenced document (including any amendments) applies.
IEC 60050(581):1978,International Electrotechnical Vocabulary (IEV) – Chapter 581:Electromechanical components for electronic equipment
Amendment 1 (1998)
lEC 60068-1:1988，Environmental testing – Part 1: General and guidanceAmendment 1 (1992)
IEC 60249-2-4:1987,Base materials for printed circuits – Part 2: Specifications – SpecificationNo.4:Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
Amendment 3 (1993)
IEC 60249-2-5:1987,Base materials for printed circuits – Part 2: Specifications – SpecificationNo. 5:Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (verticalburning test)
Amendment 3 (1993)Amendment 4 (1994)
IEC 60249-2-11:1987,Base materials for printed circuits – Part 2:Specifications -SpecificationNo.11:Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose gradefor use in the fabrication of multilayer printed boards
Amendment 2 (1993)
Amendment 3 (1994)
IEC 60249-2-12:1987，Base materials for printed circuits – Part 2: Specifications -Specification No.12:Thin epoxide woven glass fabric copper-clad laminated sheet of definedflammability, for use in the fabrication of multilayer printed boards
Amendment 2 (1993)
Amendment 3 (1994)
lEC 60326-2:1990，Printed boards – Part 2: Test methodsAmendment 1 (1992)
IEC 60326-3:1991, Printed boards – Part 3: Design and use of printed boards
IEC 60326-5:1980，Printed boards – Part 5: Specification for single and double sided printedboards with plated-through holes
Amendment 1 (1989)
IEC 60352-1:1997， Solderless connections – Part 1: Wrapped connections – General require-ments, test methods and practical guidance
IEC 60512-1:1994，Electromechanical components for electronic equipment – Basic testingprocedures and measuring methods – Part 1: General
IEC 60512-2:1985,Electromechanical components for electronic equipment; basic testingprocedures and measuring methods – Part 2: General examination，electrical continuity andcontact resistance tests, insulation tests and voltage stress tests
Amendment 1 (1994)
IEC 60512-4:1976，Electromechanical components for electronic equipment; basic testingprocedures and measuring methods – Part 4: Dynamic stress tests
IEC 60512-6:1984，Electromechanical components for electronic equipment; basic testingprocedures and measuring methods – Part 6: Climatic tests and soldering tests
IEC 6051 2-1 1 -1 :1 995, Electromechanical components for electronic equipment – Basic testing procedures and measuring methods – Part 11: Climatic tests – Section 1: Test 11a: Climatic sequence