IEC 61189-5-501:2021 pdf free download Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes
1 Scope
This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized test coupon are used for the evaluation.
Coupons are conditioned and measurements taken at a high temperature and humidity.
The electrodes are electrically biased during conditioning to facilitate electrochemical reactions, as shown in Figure 1 and Figure 3.
Reference can be made to IEC TR 61189-5-506, which examines different geometry comb patterns: 400 µm x 500 µm; 400 µm x 200 µm; and 318 µm x 318 µm.
Specifically, this method is designed to simultaneously assess:
leakage current caused by ionized water films and electrochemical degradation of test vehicle, (corrosion, dendritic growth);
provide metrics that can appropriately be used for binary classification (e.g. go/no go;pass/fail);
compare, rank or characterize materials and processes.
This test is carried out at high humidity and heat conditions.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their contentconstitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latestedition of the referenced document (including anyamendments) applies.
IEC 60068-1:2013,Environmental testing – Part 1: General and guidance
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods forsolderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (sMD)
IEC 60068-2-67,Environmental testing – Part 2-67:Tests -Test Cy: Damp heat, steady state,accelerated test primarily intended for components
IEC 61189-5-504,Test methods for electrical materials, printed board and other interconnectionstructures and assemblies – Part 5-504:General test methods for materials and assemblies -Process ionic contamination testing (PICT)
IEC TR 61189-5-506, Test methods for electrical materials, printed boards and otherinterconnection structures and assemblies – Part 5-506:General test methods for materials and
assemblies -An intercomparison evaluation to implement the use of fine pitch test structuresfor surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements forelectronic grade solder alloys and fluxed and non-fluxed solid solder for electronic solderingapplications
IEC 61249-2-7，Materials for printed boards and other interconnecting structures – Part 2-7;Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of defined
flammability (vertical burning test), copper-clad
3 Terms and definitions
For the purposes of this document, the terms and definitions given in lEC 60068-1, IEC 60068-2-58,IEC 60194-2,and lEC 61190-1-3 apply.
ISO and lEC maintain terminological databases for use in standardization at the followingaddresses:
.IEC Electropedia: available at http://www.electropedia.orgl
.Iso Online browsing platform: available at http://www.iso.orglobp4Equipment/Apparatus
4.1 Measurement instrument
This shall consist of a measuring device capable of measuring insulation resistance in the rangeof at least 10 Q to 10 12 o.
IEC 61189-5-501:2021 pdf free download
